0C97055502

Laird Technologies EMI

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0C97055502

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RFI EMI GROUNDING MATERIAL 25FT

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Mfr	Laird Technologies EMI
Type	Fingerstock
Shape	-
Width	0.340" (8.64mm)
Height	0.070" (1.78mm)
Length	24.000" (609.60mm)
Series	Twist
Package	Bulk
Plating	Unplated
Material	Beryllium Copper
Shelf Life	-
Product Status	Active
Shelf Life Start	-
Attachment Method	Adhesive
Plating - Thickness	-
Operating Temperature	121°C
Storage/Refrigeration Temperature	-