28-6554-18

Aries Electronics

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28-6554-18

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CONN IC DIP SOCKET ZIF 28POS

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Mfr	Aries Electronics
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Series	55
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyetheretherketone (PEEK), Glass Filled
Contact Resistance	-
Base Product Number	28-6554
Contact Finish - Post	Nickel Boron
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 250°C
Contact Finish - Mating	Nickel Boron
Contact Material - Post	Beryllium Nickel
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Nickel
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	50.0µin (1.27µm)
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Number of Positions or Pins (Grid)	28 (2 x 14)