28-6556-40

Aries Electronics

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28-6556-40

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CONN IC DIP SOCKET 28POS GOLD

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Mfr	Aries Electronics
Type	DIP, 0.6" (15.24mm) Row Spacing
Series	6556
Package	Bulk
Features	Open Frame
Termination	Solder Cup
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Resistance	-
Base Product Number	28-6556
Contact Finish - Post	Tin
Current Rating (Amps)	3 A
Operating Temperature	-
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.180" (4.57mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Number of Positions or Pins (Grid)	28 (2 x 14)