30-81250-610C

Aries Electronics

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30-81250-610C

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CONN IC DIP SOCKET 30POS GOLD

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Mfr	Aries Electronics
Type	DIP, 0.6" (15.24mm) Row Spacing
Series	8
Package	Bulk
Features	Closed Frame, Elevated
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Resistance	-
Base Product Number	30-8125
Contact Finish - Post	Gold
Current Rating (Amps)	3 A
Operating Temperature	-55°C ~ 105°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.140" (3.56mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Number of Positions or Pins (Grid)	30 (2 x 15)