558-10-360M19-001104

Preci-Dip

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BGA SURFACE MOUNT 1.27MM

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Mfr	Preci-Dip
Type	BGA
Series	558
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Mounting Type	Surface Mount
Pitch - Mating	0.050" (1.27mm)
Product Status	Active
Housing Material	FR4 Epoxy Glass
Contact Resistance	10mOhm
Base Product Number	558-10
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.086" (2.20mm)
Contact Material - Mating	Brass
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	360 (19 x 19)