BDN13-3CB/A01
CTS Thermal Management Products
Product No:
BDN13-3CB/A01
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEATSINK CPU W/ADHESIVE 1.31"SQ
Quantity:
Delivery:
Payment:
In Stock : 1045 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$3.3535
$3.3535
10
$3.2642
$32.642
25
$3.17604
$79.401
50
$2.99972
$149.986
100
$2.82321
$282.321
250
$2.646776
$661.694
500
$2.558559
$1279.2795
1000
$2.29388
$2293.88
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Product Information
Parameter Info
User Guide
| Mfr | CTS Thermal Management Products |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.310" (33.27mm) |
| Length | 1.310" (33.27mm) |
| Series | BDN |
| Package | Box |
| Diameter | - |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Shelf Life | 24 Months |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | BDN13 |
| Thermal Resistance @ Natural | 16.10°C/W |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 400 LFM |
Recommended Parts
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
