BDN15-3CB/A01

CTS Thermal Management Products

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BDN15-3CB/A01

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HEATSINK CPU W/ADHESIVE 1.51"SQ

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Mfr	CTS Thermal Management Products
Type	Top Mount
Shape	Square, Pin Fins
Width	1.510" (38.35mm)
Length	1.510" (38.35mm)
Series	BDN
Package	Tray
Diameter	-
Material	Aluminum
Fin Height	0.355" (9.02mm)
Shelf Life	24 Months
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Included)
Base Product Number	BDN15
Thermal Resistance @ Natural	15.10°C/W
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 400 LFM