BU200Z-178-HT

On Shore Technology Inc.

Product No:

BU200Z-178-HT

Manufacturer:

Package:

Batch:

Datasheet:

Description:

CONN IC DIP SOCKET 20POS GOLD

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Country

Quantity

Mfr	On Shore Technology Inc.
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	BU-178HT
Package	Bulk
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Surface Mount
Pitch - Mating	0.100" (2.54mm)
Product Status	Obsolete
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Contact Resistance	7mOhm
Base Product Number	BU200Z
Contact Finish - Post	Copper
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.059" (1.50mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	Flash
Contact Finish Thickness - Mating	78.7µin (2.00µm)
Number of Positions or Pins (Grid)	20 (2 x 10)