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EVSC800-PI-2-K6

CR Technology

Product No:

EVSC800-PI-2-K6

Manufacturer:

CR Technology

Package:

-

Batch:

-

Datasheet:

Description:

Thermal Insulation Pad

Quantity:

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Product Information

Parameter Info

User Guide

Mfr CR Technology
Type Ultra Thin Dielectric Sheet
Color Gray
Shape -
Usage Multi
Series EVSC
Outline 305.00mm x 305.00mm
Package Sheet
Adhesive -
Material Silicone
Thickness 0.0063" (0.160mm)
Shelf Life -
Product Status Active
Backing, Carrier -
Digi-Key Storage -
Shelf Life Start -
Thermal Resistivity -
Thermal Conductivity 1.1W/m-K
Storage/Refrigeration Temperature -