JET551SNL30T5

Chip Quik Inc.

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JET551SNL30T5

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Description:

JET PRINTING SOLDER PASTE SN96.5

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Mfr	Chip Quik Inc.
Form	Syringe, 3.53 oz (100g)
Type	Solder Paste
Series	CHIPQUIK®
Weight	-
Package	Bulk
Process	-
Diameter	-
Flux Type	No-Clean
Shelf Life	12 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-