TE0813-01-4BE11-A

Trenz Electronic GmbH

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TE0813-01-4BE11-A

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MODULE MPSOC 4GB DDR4

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Mfr	Trenz Electronic GmbH
Speed	-
Series	-
Package	Box
RAM Size	2GB
Flash Size	128MB
Co-Processor	-
Connector Type	Board-to-Board (BTB) Socket
Core Processor	Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Product Status	Discontinued at Digi-Key
Size / Dimension	2.050" L x 2.990" W (52.00mm x 76.00mm)
Module/Board Type	FPGA Core
Operating Temperature	0°C ~ 85°C