TS991SNL35T4

Chip Quik Inc.

Product No:

TS991SNL35T4

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Description:

THERMALLY STABLE SOLDER PASTE NC

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Mfr	Chip Quik Inc.
Form	Syringe, 1.23 oz (34.869g)
Type	Solder Paste
Series	CHIPQUIK®
Weight	-
Package	Bulk
Process	-
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Shelf Life	12 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423°F (217°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 77°F (3°C ~ 25°C)