XR2D-4001-N

Omron Electronics Inc-EMC Div

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XR2D-4001-N

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CONN IC DIP SOCKET 40POS GOLD

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Mfr	Omron Electronics Inc-EMC Div
Type	DIP, 0.6" (15.24mm) Row Spacing
Series	XR2
Package	Bulk
Features	Carrier
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Obsolete
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Contact Resistance	20mOhm
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Beryllium Copper
Termination Post Length	-
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	29.5µin (0.75µm)
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Number of Positions or Pins (Grid)	40 (2 x 20)